<div>Boston Materials produces a new class of materials that are conductive and durable like metal, yet light like plastic. The underlying technology revolves around vertically aligning carbon fibers to create materials with highly efficient energy dissipation properties. We use these highly differentiated materials to solve critical challenges relating to thermal management, vehicle weight reduction, and improving resource efficiency across Semiconductor, Electrified Vehicles, and Aerospace industries. Backed by proven manufacturing processes and validation in performance-critical applications across high-growth sectors, industry leaders turn to Boston Materials to go beyond today’s known limitations.</div><div> </div><div><br></div><div><span style="font-size:16pt;">OPPORTUNITY KNOCKS</span></div><div>Not often in one’s career do we get the chance to—</div><div><br></div><div><b>Get close to the mission.</b> Getting a real sense of what the business does and how our work directly affects the outcome. Where everyone is involved with the company’s success. No layers, no silos, no bureaucracy. Just the opportunity to make the greatest impact with the most responsibility.</div><div><b> </b></div><div><b>Innovate faster.</b> Adapting to changes in the market at record speed. No multi-layer signoffs. Fewer executives and shareholders to gain approval from. Instead, the latitude needed to get a new idea, product, or process off the ground quickly. Where we can experiment and test new ideas— and are encouraged to do so. We create solutions to problems that our audiences truly care about and understand customers won’t wait for us to figure them out.</div><div><b> </b></div><div><b>Branch beyond our role.</b> We’re not defined by past experiences or confined by our current job description. Every day offers opportunities to have influence and be challenged with new projects and tasks. Working shoulder-to-shoulder with some of the top talent in the industry, we’re able to showcase our talents, expand our knowledge, develop new skills, and take ownership and act. All while contributing to the overall success of the organization.</div><div><b> </b></div><div><b>Create critical resources.</b> The transition to a decarbonized economy is already underway and advanced computing is everywhere. Armed with coveted technologies and solutions, we unlock the way to accelerate electrification, increase compute efficiency, and harness cleaner energy— changing entire industries and our planet.</div><div> </div><div>Opportunity knocks at Boston Materials. Will you answer the call?</div><div><br></div><div>Solve one of the most critical challenges facing the Semiconductor and Electronics Industry – thermal management! Join the Boston Materials team to help unlock the full potential of Z-axis Fiber™ technology and pave the way for groundbreaking advancements powering AI. </div><div><br></div><div><b style="font-size:18px;">The Role</b></div><div><br></div><div><span style="font-size:10pt;">We are seeking a highly motivated Applications Engineer to serve as the primary technical partner for our customers as they evaluate and adopt our high-performance thermal interface material (TIM) products. This role is ideal for an engineer who thrives at the intersection of customer engagement, problem-solving, and product performance validation. You will be responsible for leading early- to mid-stage customer interactions, capturing and translating requirements into actionable technical work, and ensuring that customers have the data, samples, and support they need to successfully integrate and qualify our TIM in their advanced semiconductor packaging applications. This position offers the opportunity to work closely with hyperscalers, ODMs, and OSATs, and to influence the adoption of cutting-edge thermal solutions in next-generation AI and data center systems.</span></div><br><br><h3>Your Responsibilities</h3><ul><li>Act as the primary technical point of contact for ODM, OSAT, and hyperscaler engineering teams during early and mid-stage engagement. </li><li>Work closely with business development to uncover and document customer requirements, including thermal budgets, reliability standards, and process/package constraints.</li><li>Lead internal scoping and coordination of customer-specific technical work, including reliability testing, and evaluation of alternative product variants, compliance ranges, or gaskets.</li><li>Prepare and deliver technical collateral such as application notes, design guides, and data reports to support customer decision-making and qualification processes.</li><li>Support customer testing trials, troubleshooting technical issues in real time and coordinating resolution with internal engineering, manufacturing, and quality teams.</li><li>Capture customer feedback and synthesize insights to guide internal product development and roadmap planning.</li><li>Partner with sales and business development teams to provide pre-sales technical support and contribute to the overall customer success strategy.</li><li>Gather and synthesize customer feedback (e.g., on performance, handling, supply chain needs) and bring it back to the product team.</li></ul><h3>Your Skills and Expertise</h3><ul><li>Bachelor’s or Master’s degree in Materials Science, Mechanical Engineering, Chemical Engineering, or related field.</li><li>3–7 years of experience in semiconductor packaging, thermal interface materials, or applications engineering in a B2B technical product company.</li><li>Strong understanding of semiconductor packaging processes (flip-chip, <a href="http://2.5D/3D">2.5D/3D</a> integration, TIM1/TIM1.5/TIM2) and associated reliability testing (uHAST, TCT, HTS, etc.).</li><li>Proven ability to lead cross-functional technical efforts and deliver customer-specific solutions on time.</li><li>Excellent communication skills, with the ability to explain complex technical topics to both engineers and non-technical stakeholders.</li><li>Hands-on experience with lab testing, data analysis, and report generation; familiarity with tools such as thermal test setups, C-SAM, X-ray, or FEA modeling is a plus.</li></ul><h3>Summary of Benefits</h3><ul><li>Health, Vision &amp; Dental – Boston Materials pays 75% of Health, Vision and Dental Care coverage for employee and dependents</li><li>401(k) plan</li><li>4 weeks of supplemental Paid Parental and Family Leave</li><li>Unlimited Paid Time Off</li><li>Holidays: 14 days/year</li></ul><br><div>Boston Materials is an EOE and at the forefront of materials innovation, the key to which is diverse teams with unique backgrounds and experiences. We are committed to employing a diverse workforce with equal employment opportunities regardless of race, color, religion, sex, national origin, age, sexual orientation, gender identity, gender expression, marital status, veteran status, or disability.</div><div><br></div><div>Applicants must be currently authorized to work in the US on a full-time basis.</div>

<p>Boston Materials empowers leaders in the electronics, transportation, and energy sectors to overcome their design limitations with new materials.</p>
<p>The company's patented Z-axis Fiber&trade; is a lightweight, corrosion-resistant material with exceptional energy-diffusion capabilities (including thermal, electrical, and structural loads.) It is created entirely from reclaimed carbon fiber, allowing for high-performance, high-volume materials and components with the lowest possible carbon footprint.</p>

Thermal Systems Integration Engineer, Advanced Packaging

<div>Boston Materials produces a new class of materials that are conductive and durable like metal, yet light like plastic. The underlying technology revolves around vertically aligning carbon fibers to create materials with highly efficient energy dissipation properties. We use these highly differentiated materials to solve critical challenges relating to thermal management, vehicle weight reduction, and improving resource efficiency across Semiconductor, Electrified Vehicles, and Aerospace industries. Backed by proven manufacturing processes and validation in performance-critical applications across high-growth sectors, industry leaders turn to Boston Materials to go beyond today’s known limitations.</div><div>&nbsp;</div><div><br></div><div><span>OPPORTUNITY KNOCKS</span></div><div>Not often in one’s career do we get the chance to—</div><div><br></div><div><b>Get close to the mission.</b> Getting a real sense of what the business does and how our work directly affects the outcome. Where everyone is involved with the company’s success. No layers, no silos, no bureaucracy. Just the opportunity to make the greatest impact with the most responsibility.</div><div><b>&nbsp;</b></div><div><b>Innovate faster.</b> Adapting to changes in the market at record speed. No multi-layer signoffs. Fewer executives and shareholders to gain approval from. Instead, the latitude needed to get a new idea, product, or process off the ground quickly. Where we can experiment and test new ideas— and are encouraged to do so. We create solutions to problems that our audiences truly care about and understand customers won’t wait for us to figure them out.</div><div><b>&nbsp;</b></div><div><b>Branch beyond our role.</b> We’re not defined by past experiences or confined by our current job description. Every day offers opportunities to have influence and be challenged with new projects and tasks. Working shoulder-to-shoulder with some of the top talent in the industry, we’re able to showcase our talents, expand our knowledge, develop new skills, and take ownership and act. All while contributing to the overall success of the organization.</div><div><b>&nbsp;</b></div><div><b>Create critical resources.</b> The transition to a decarbonized economy is already underway and advanced computing is everywhere. Armed with coveted technologies and solutions, we unlock the way to accelerate electrification, increase compute efficiency, and harness cleaner energy— changing entire industries and our planet.</div><div>&nbsp;</div><div>Opportunity knocks at Boston Materials. Will you answer the call?</div><div><br></div><div>Solve one of the most critical challenges facing the Semiconductor and Electronics Industry – thermal management! Join the Boston Materials team to help unlock the full potential of Z-axis Fiber™ technology and pave the way for groundbreaking advancements powering AI. </div><div><br></div><div><b>The Role</b></div><div><br></div><div><span>We are seeking a highly motivated Applications Engineer to serve as the primary technical partner for our customers as they evaluate and adopt our high-performance thermal interface material (TIM) products. This role is ideal for an engineer who thrives at the intersection of customer engagement, problem-solving, and product performance validation. You will be responsible for leading early- to mid-stage customer interactions, capturing and translating requirements into actionable technical work, and ensuring that customers have the data, samples, and support they need to successfully integrate and qualify our TIM in their advanced semiconductor packaging applications. This position offers the opportunity to work closely with hyperscalers, ODMs, and OSATs, and to influence the adoption of cutting-edge thermal solutions in next-generation AI and data center systems.</span></div><br><br><h3>Your Responsibilities</h3><ul><li>Act as the primary technical point of contact for ODM, OSAT, and hyperscaler engineering teams during early and mid-stage engagement. </li><li>Work closely with business development to uncover and document customer requirements, including thermal budgets, reliability standards, and process/package constraints.</li><li>Lead internal scoping and coordination of customer-specific technical work, including reliability testing, and evaluation of alternative product variants, compliance ranges, or gaskets.</li><li>Prepare and deliver technical collateral such as application notes, design guides, and data reports to support customer decision-making and qualification processes.</li><li>Support customer testing trials, troubleshooting technical issues in real time and coordinating resolution with internal engineering, manufacturing, and quality teams.</li><li>Capture customer feedback and synthesize insights to guide internal product development and roadmap planning.</li><li>Partner with sales and business development teams to provide pre-sales technical support and contribute to the overall customer success strategy.</li><li>Gather and synthesize customer feedback (e.g., on performance, handling, supply chain needs) and bring it back to the product team.</li></ul><h3>Your Skills and Expertise</h3><ul><li>Bachelor’s or Master’s degree in Materials Science, Mechanical Engineering, Chemical Engineering, or related field.</li><li>3–7 years of experience in semiconductor packaging, thermal interface materials, or applications engineering in a B2B technical product company.</li><li>Strong understanding of semiconductor packaging processes (flip-chip, <a href="http://2.5D/3D">2.5D/3D</a> integration, TIM1/TIM1.5/TIM2) and associated reliability testing (uHAST, TCT, HTS, etc.).</li><li>Proven ability to lead cross-functional technical efforts and deliver customer-specific solutions on time.</li><li>Excellent communication skills, with the ability to explain complex technical topics to both engineers and non-technical stakeholders.</li><li>Hands-on experience with lab testing, data analysis, and report generation; familiarity with tools such as thermal test setups, C-SAM, X-ray, or FEA modeling is a plus.</li></ul><h3>Summary of Benefits</h3><ul><li>Health, Vision &amp; Dental – Boston Materials pays 75% of Health, Vision and Dental Care coverage for employee and dependents</li><li>401(k) plan</li><li>4 weeks of supplemental Paid Parental and Family Leave</li><li>Unlimited Paid Time Off</li><li>Holidays: 14 days/year</li></ul><br><div>Boston Materials is an EOE and at the forefront of materials innovation, the key to which is diverse teams with unique backgrounds and experiences. We are committed to employing a diverse workforce with equal employment opportunities regardless of race, color, religion, sex, national origin, age, sexual orientation, gender identity, gender expression, marital status, veteran status, or disability.</div><div><br></div><div>Applicants must be currently authorized to work in the US on a full-time basis.</div>

Thermal Systems Integration Engineer, Advanced Packaging

About the Job

About the Company

Boston Materials

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